Our advanced manufacturing platform is used to offer a prototyping and low volume manufacturing service to individuals and businesses.
The manufacturing facility has the ability to produce complex electronic products using components as small as 01005 (0.4 mm x 0.2 mm) and as complex as BGA and 75 mm fine pitch connectors, at a maximum printed circuit board size of 460 mm x 400 mm.
The newest addition to the manufacturing platform includes a Samsung SM482 component placement line combined with a 6 zone forced convection oven system that is capable of both leaded and lead-free assemblies, while the MY600 Jet Printer eliminates the use of stencils in the production process.
These processes are designed to save cost and time for clients requiring a rapid prototyping and low volume manufacturing service. Quality control is part of every step of the process to ensure that products are manufactured to the IPC Class 3 manufacturing standards applicable to high performance electronic products.